Research progress of vapor chamber heat dissipation technology

被引:0
|
作者
Wan X. [1 ]
Cui X. [1 ]
Xie R. [2 ]
机构
[1] School of Energy and Power Engineering, University of Shanghai for Science and Technology, Shanghai
[2] Shanghai Institute of Technical Physics of the Chinese Academy of Sciences, Shanghai
关键词
Heat transfer; Mass transfer; Two phase flow; Ultrathin; Vapor chamber;
D O I
10.16085/j.issn.1000-6613.2021-0706
中图分类号
学科分类号
摘要
As a new two-phase heat transfer technology, vapor chamber has the advantages of high thermal conductivity, good temperature uniformity, reversible heat flow direction, and so on. It overcomes the problems of traditional heat pipe, such as small contact area, large heat resistance and ununiform heat flow density, and has become one of the effective ways to solve the heat dissipation of electronic devices with high heat flow density in the future electronic industry. In this paper, the three types of wick structures, namely, grooved, sintered powder and sintered wire mesh were summarized, and the preparation methods of each capillary wicks were introduced and their advantages and disadvantages were compared. The latest research progress of heat and mass transfer theory in vapor chamber was reviewed. the boiling theory of transport model to capture the gas-liquid interface was used by researchers. The critical heat flux was confirmed. The flow and heat transfer law of working medium was analyzed in the vapor chamber. Then, the factors affecting the performance of vapor chamber, including fluid selection, liquid filling rate, heat load, inclination, et al. were analyzed. Finally, the application direction of the vapor chamber was prospected from the perspective of background environment. © 2022, Chemical Industry Press Co., Ltd. All right reserved.
引用
收藏
页码:554 / 568
页数:14
相关论文
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