Low temperature direct bonding of polyoxymethylene (POM) through self assembly monolayer (SAM)

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作者：
机构：
[1] Fu, Weixin
[2] Kuwae, Hiroyuki
[3] Ma, Bo
[4] Shoji, Shuichi
[5] Mizuno, Jun
来源：
| 2017年 / Institute of Electrical and Electronics Engineers Inc., United States卷
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7939349
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摘要：
Self assembled monolayers
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