Effect of Co particle content on microstructure and properties of SnBi/Cu joints

被引：0
|
作者：
Li Z. [1 ]
Li H. [1 ]
Guo Y. [1 ]
Chen Y. [1 ]
Cheng D. [1 ]
Hu D. [1 ]
Gao J. [1 ]
Li D. [1 ]
机构：
[1] School of Aeronautical Manufacturing Engineering, Nanchang Hangkong University, Nanchang
来源：
Cailiao Gongcheng/Journal of Materials Engineering | 2022年 / 50卷 / 07期
关键词：
Co particle; mechanical property; microstructure; Sn35Bi solder; wettability;
D O I：
10.11868/j.issn.1001-4381.2020.001151
中图分类号：
学科分类号：
摘要：
The microstructure of Sn35Bi-a;CoU: 0%, 0. 3%, 0. 7 %, 1. 0 %, 1. 2 %, 1. 5%, mass fraction) composite solder/Cu joints was observed by scanning electron microscopy (SEM). Combined energy spectrum (EDS) and XRD analysis, the difference of joint structure was studied. The mechanical properties of joints were tested by universal testing machine, and the influence mechanism of Co particle content on the structure and properties of SnBi/Cu joints was studied. The results show that, with the increase of Co particle content, the wettability of Sn35Bi-Co composite solder increases first and then decreases. When Co particle content is 0. 7%, the wettability is the best. When appropriate amount of Co particles is added to the Sn35Bi/Cu joint in the solidification stage, the weld microstructure can be effectively refined, the IMC layer of the interface is more flat, Co atoms in the weld replace Cu atoms in the interface Cu6Sn3 layer, and the (Cu, Co)6Sn3 solid solution can be formed, which can strengthen the IMC layer of the interface. The shear strength of Sn35Bi-Co/Cu joints increases first and then decreases with the increase of Co particle content. When Co particle content is 0. 7%, the maximum value of 54. 09 MPa is obtained. © 2022 Beijing Institute of Aeronautical Materials (BIAM). All rights reserved.
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页码：149 / 155
页数：6
相关论文
共 18 条
  • [11] ZHANG L, LONG W., WANG F., Microstructures, interface reaction, and properties of Sn-Ag-Cu and Sn-Ag-Cu-0. 5CuZnAl solders on Fe suhstrate, Journal of Materials Science: Materials in Electronics, 31, pp. 6645-6653, (2020)
  • [12] FAN J, ZHAI H., LIU Z, Et al., Microstructure evolution, thermal and mechanical property of Co alloyed Sn-0. 7Cu lead-free solder, Journal of Electronic Materials, 49, 4, pp. 2660-2668, (2020)
  • [13] ZHAO M, ZHANG L, LIU Z Q, Et al., Structure and properties of Sn-Cu lead-free solders in electronics packaging, Science and Technology of Advanced Materials, 20, 1, pp. 421-444, (2019)
  • [14] ZHU X, PENG J, WEI X, Et al., Interfacial reaction and microstructure evolution of Sn-9Zn/Ni(Cu) solder joints, Metals, 9, 5, (2019)
  • [15] GAO F, NISHIKAWA H., Effects of Co and Ni addition on reactive diffusion hetween Sn-3. 5Ag solder and Cu during soldering and annealing, Materials Science and Engineering: A, 420, 2, pp. 39-46, (2006)
  • [16] GAO F, TAKEMOTO T., Effects of addition participation in the interfacial reaction on the growth patterns of Cui6Sn5-based IMCs during reflow process, Journal of Alloys and Compounds, 421, 1, pp. 283-288, (2006)
  • [17] LUO J D, XUE S B., YANG J Q, Et al., Interfacial microstructure and properties of SnCuNi-xPr/Cu solder joint[J], Transactions of the China Welding Institution, 33, 5, pp. 49-52, (2012)
  • [18] LIU X Y., The development of tin hased composite lead-free solders, (2010)
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