The interface crack problem of bonded piezoelectric and elastic half-space under transient electromechanical loads

被引：0

作者：

Meguid, S.A. ^{[1
]}

Zhao, X. ^{[1
]}

机构：

[1] Eng. Mechanics and Design Laboratory, Dept. of Mech. and Industrial Eng., University of Toronto, 5 King's College Road, Toronto, Ont. M5S 3G8, Canada

来源：

| 1600年 / American Society of Mechanical Engineers卷 / 69期

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