Study on the non-model method of thermosetting resin curing kinetics

被引：0
|
作者：
机构：
来源：
| 2001年 / Chengdu University of Science and Technology卷 / 17期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [31] Development of a New Curing Agent for Thermosetting Resin Using Natural Polyphenol
    Ohki, Y.
    IEEE ELECTRICAL INSULATION MAGAZINE, 2014, 30 (01) : 57 - 58
  • [32] Autocatalytic curing kinetics of thermosetting polymers: A new model based on temperature dependent reaction orders
    Zhao, Lei
    Hu, Xiao
    POLYMER, 2010, 51 (16) : 3814 - 3820
  • [33] Establishment and verification of curing kinetics model of 603 epoxy resin system
    Li T.
    Li Y.
    Chen C.
    Gu Y.
    Wang S.
    Li J.
    Li G.
    Li M.
    Zhang Z.
    Fuhe Cailiao Xuebao/Acta Materiae Compositae Sinica, 2018, 35 (01): : 95 - 102
  • [34] Copper particles/epoxy resin thermosetting conductive adhesive using polyamide resin as curing agent
    Dang, Zhi-Min
    Zhang, Bo
    Li, Jinge
    Zha, Jun-Wei
    Hu, Guo-Hua
    JOURNAL OF APPLIED POLYMER SCIENCE, 2012, 126 (03) : 815 - 821
  • [35] Non-model model organisms
    James J. Russell
    Julie A. Theriot
    Pranidhi Sood
    Wallace F. Marshall
    Laura F. Landweber
    Lillian Fritz-Laylin
    Jessica K. Polka
    Snezhana Oliferenko
    Therese Gerbich
    Amy Gladfelter
    James Umen
    Magdalena Bezanilla
    Madeline A. Lancaster
    Shuonan He
    Matthew C. Gibson
    Bob Goldstein
    Elly M. Tanaka
    Chi-Kuo Hu
    Anne Brunet
    BMC Biology, 15
  • [36] Non-model model organisms
    Russell, James J.
    Theriot, Julie A.
    Sood, Pranidhi
    Marshall, Wallace F.
    Landweber, Laura F.
    Fritz-Laylin, Lillian
    Polka, Jessica K.
    Oliferenko, Snezhana
    Gerbich, Therese
    Gladfelter, Amy
    Umen, James
    Bezanilla, Magdalena
    Lancaster, Madeline A.
    He, Shuonan
    Gibson, Matthew C.
    Goldstein, Bob
    Tanaka, Elly M.
    Hu, Chi-Kuo
    Brunet, Anne
    BMC BIOLOGY, 2017, 15
  • [37] Non-model organisms
    Nawy, Tal
    NATURE METHODS, 2012, 9 (01) : 37 - 37
  • [38] Adhesion problematics and curing kinetics in a thermosetting matrix for stitch-free non-crimp fabric
    Kruppke, Iris
    Hund, Rolf-Dieter
    Cherif, Chokri
    TEXTILE RESEARCH JOURNAL, 2016, 86 (13) : 1413 - 1424
  • [39] Study on curing kinetics of diallyl-bearing epoxy resin using sulfur as curing agent
    Zhang, Guangpu
    Cheng, Jue
    Shi, Ling
    Lin, Xin
    Zhang, Junying
    THERMOCHIMICA ACTA, 2012, 538 : 36 - 42
  • [40] Study on curing kinetics of a diglycidyl ether of bisphenol A epoxy resin/microencapsulated curing agent system
    Wang Fang
    Xiao Jun
    Wang Jing-wen
    Li Shu-qin
    HIGH PERFORMANCE POLYMERS, 2012, 24 (08) : 730 - 737
12345