Fabrication of high-density protein microarray on an EDTA-PDMS substrate by microcontact printing

被引：0
|
作者：
Yang, Haijun [1 ,2 ]
Li, Hai [1 ]
Wang, Peng [1 ]
Li, Bin [1 ]
机构：
[1] Shanghai Institute Applied Physics, Chinese Academy of Sciences, Shanghai 201800, China
[2] Graduate School, Chinese Academy of Sciences, Beijing 100049, China
来源：
| 2008年 / Science Press, 18,Shuangqing Street,Haidian, Beijing, 100085, China卷 / 31期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [41] Identification of Seroreactive Proteins of Leptospira interrogans Serovar Copenhageni Using a High-Density Protein Microarray Approach
    Lessa-Aquino, Carolina
    Rodrigues, Camila Borges
    Pablo, Jozelyn
    Sasaki, Rie
    Jasinskas, Algis
    Liang, Li
    Wunder, Elsio A., Jr.
    Ribeiro, Guilherme S.
    Vigil, Adam
    Galler, Ricardo
    Molina, Douglas
    Liang, Xiaowu
    Reis, Mitermayer G.
    Ko, Albert I.
    Medeiros, Marco Alberto
    Felgner, Philip L.
    PLOS NEGLECTED TROPICAL DISEASES, 2013, 7 (10):
  • [42] Microintaglio Printing of In situ Synthesized Proteins Enables Rapid Printing of High-Density Protein Microarrays Directly from DNA Microarrays
    Biyani, Manish
    Moriyasu, Junpei
    Tanaka, Yoko
    Sato, Shusuke
    Ueno, Shingo
    Ichiki, Takanori
    APPLIED PHYSICS EXPRESS, 2013, 6 (08)
  • [43] High-throughput tissue microarray: The utility of high-density pileup array
    Nitanda, T.
    Souda, M.
    Groen, R.
    Fukuoka, J.
    VIRCHOWS ARCHIV, 2017, 471 : S252 - S252
  • [44] Three-Dimensional Printing with Waste High-Density Polyethylene
    Gudadhe, Aniket
    Bachhar, Nirmalya
    Kumar, Anil
    Andrade, Prem
    Kumaraswamy, Guruswamy
    ACS APPLIED POLYMER MATERIALS, 2019, 1 (11): : 3157 - 3164
  • [45] HIGH-DENSITY MULTILAYER SUBSTRATE USING BENZOCYCLOBUTENE DIELECTRIC
    SHIMOTO, T
    MATSUI, K
    KIMURA, M
    UTSUMI, K
    NEC RESEARCH & DEVELOPMENT, 1993, 34 (02): : 191 - 198
  • [46] INKJET PRINTING OF HIGH-DENSITY BACTERIAL ARRAYS FOR BIOSENSOR APPLICATIONS
    Cho, Myoung-Ock
    Yoon, Sunghee
    Kim, Jung Kyung
    NEMB2010: PROCEEDINGS OF THE ASME FIRST GLOBAL CONGRESS ON NANOENGINEERING FOR MEDICINE AND BIOLOGY - 2010, 2010, : 335 - 336
  • [47] Development of High-Density Hybrid Substrate for Heterogeneous Integration
    Peng, Chia-Yu
    Lau, John H.
    Ko, Cheng-Ta
    Lee, Paul
    Lin, Eagle
    Yang, Henry Kai-Ming
    Lin, Puru Bruce
    Xia, Tim
    Chang, Leo
    Lin, Curry
    Lee, Tzu Nien
    Wong, Jason
    Ma, Mike
    Tseng, Tzyy-Jang
    2021 IEEE CPMT SYMPOSIUM JAPAN (ICSJ), 2021, : 5 - 8
  • [48] High-density probe substrate for testing optical interconnects
    Thacker, HD
    Ogunsola, OO
    Bakir, MS
    Meindl, JD
    PROCEEDINGS OF THE IEEE 2005 INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE, 2005, : 159 - 161
  • [49] High-Density Package Substrate Using Organic Interposer
    Miki S.
    Tsukamoto K.
    Sakaguchi Y.
    Kajiki A.
    Journal of Japan Institute of Electronics Packaging, 2023, 26 (04) : 361 - 366
  • [50] ELECTRON-BEAM FABRICATION OF HIGH-DENSITY CIRCUITS
    VARNELL, GL
    BULLETIN OF THE AMERICAN PHYSICAL SOCIETY, 1976, 21 (11): : 1339 - 1339
12345