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- [32] Simulation Based Experimental Study of the Temperature and Power Density Distribution in a High-Power LED 2015 38TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY (ISSE 2015), 2015, : 179 - 182
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- [34] Development Process of Phosphor Coating with Screen Printing for White LED Packaging 2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP), 2011, : 103 - 107
- [37] Thermal Resistance and Temperature Distribution in Blue and White High-Power LED Arrays 2017 23RD INTERNATIONAL WORKSHOP ON THERMAL INVESTIGATIONS OF ICS AND SYSTEMS (THERMINIC), 2017,
- [39] Characteristics Study of Die-Bond Process of High-Power LED Package IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 8 (11): : 2007 - 2011