Effect of palladium on the mechanical properties of Cu-Al intermetallic compounds

被引：0
|
作者：
20150300423851
机构：
[1] [1,Lim, Adeline B.Y.
[2] Long, Xin
[3] 2,Shen, Lu
[4] Chen, Xi
[5] Ramanujan, R.V.
[6] Gan, Chee Lip
[7] Chen, Zhong
来源：
Lim, Adeline B.Y. | 1600年 / Elsevier Ltd卷 / 628期
关键词：
Corrosion resistance;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [21] On the mechanical properties of Al/Cu-grid/Al intermetallic composite
    Essoussi, Hamza
    Ettaqi, Said
    JOURNAL OF METALS MATERIALS AND MINERALS, 2021, 31 (01): : 88 - 94
  • [22] INTERMETALLIC COMPOUNDS IN CU-AL WIRE BONDING CONTACTS OF INTEGRATED-CIRCUITS STUDIED BY AES
    KIESSLING, W
    ZSCHECH, E
    METALL, 1991, 45 (08): : 772 - 774
  • [23] Structure and mechanical properties of Cu-Al alloys under pulse compression
    Shakhalova, G.I.
    Evplov, A.I.
    Problemy Prochnosti, 1992, (07): : 44 - 47
  • [24] Novel approach to optimize the mechanical properties of Cu-Al composite wires
    Dashti, Alireza
    Keller, Clement
    Vieille, Benoit
    Guillet, Alain
    INTERNATIONAL JOURNAL OF MATERIAL FORMING, 2022, 15 (03)
  • [25] Intermetallic compound formation at Cu-Al wire bond interface
    Bae, In-Tae
    Jung, Dae Young
    Chen, William T.
    Du, Yong
    JOURNAL OF APPLIED PHYSICS, 2012, 112 (12)
  • [26] Combined effect of texture and nanotwins on mechanical properties of the nanostructured Cu and Cu-Al films prepared by magnetron sputtering
    Zhang, P.
    Zhang, J. Y.
    Li, J.
    Liu, G.
    Wu, K.
    Wang, Y. Q.
    Sun, J.
    JOURNAL OF MATERIALS SCIENCE, 2015, 50 (04) : 1901 - 1907
  • [27] An Investigation on Nanoscale Bondability between Cu-Al Intermetallic Compound
    Hsu, Hsiang-Chen
    Chien, Jih-Hsin
    Wang, Chen-Yi
    Chu, Li-Ming
    Ju, Shin-Pon
    Fu, Shen-Li
    Bai, Miin Shyan
    2013 8TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT), 2013, : 158 - 161
  • [28] Microstructure evolution and mechanical properties of Cu-Al joints by ultrasonic welding
    Yang, J. W.
    Cao, B.
    He, X. C.
    Luo, H. S.
    SCIENCE AND TECHNOLOGY OF WELDING AND JOINING, 2014, 19 (06) : 500 - 504
  • [29] Annealing effect on microstructure and mechanical properties of Cu-Al alloy subjected to Cryo-ECAP
    Wei, Kun Xia
    Wang, Sheng Long
    Wei, Wei
    Du, Qing Bo
    Alexandrov, Igor, V
    Hu, Jing
    OPEN ENGINEERING, 2018, 8 (01): : 377 - 381
  • [30] Novel approach to optimize the mechanical properties of Cu-Al composite wires
    Alireza Dashti
    Clément Keller
    Benoit Vieille
    Alain Guillet
    International Journal of Material Forming, 2022, 15
12345