Effect of palladium on the mechanical properties of Cu-Al intermetallic compounds

被引：0
|
作者：
20150300423851
机构：
[1] [1,Lim, Adeline B.Y.
[2] Long, Xin
[3] 2,Shen, Lu
[4] Chen, Xi
[5] Ramanujan, R.V.
[6] Gan, Chee Lip
[7] Chen, Zhong
来源：
Lim, Adeline B.Y. | 1600年 / Elsevier Ltd卷 / 628期
关键词：
Corrosion resistance;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [1] Effect of palladium on the mechanical properties of Cu-Al intermetallic compounds
    Lim, Adeline B. Y.
    Long, Xin
    Shen, Lu
    Chen, Xi
    Ramanujan, R. V.
    Gan, Chee Lip
    Chen, Zhong
    JOURNAL OF ALLOYS AND COMPOUNDS, 2015, 628 : 107 - 112
  • [2] Effect of Palladium on the Mechanical Properties of Cu and Cu-Al Intermetallic Compounds
    Lim, Adeline B. Y.
    Long, Xin
    Shen, Lu
    Chen, Xi
    Ramanujan, Raju
    Gan, Chee Lip
    Chen, Zhong
    PROCEEDINGS OF THE 2013 IEEE 15TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC 2013), 2013, : 276 - 281
  • [3] Properties of Cu-Al Intermetallic Compounds in Copper Wire Bonding
    Zhang, Binhai
    Wang, Techun
    Cong, Yuqi
    Zhao, Mike
    Fan, Xiangquan
    Wang, Jiaji
    2010 11TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP), 2010, : 213 - 216
  • [4] Characterization of intermetallic compounds in Cu-Al ball bonds: layer growth, mechanical properties and oxidation
    Kouters, M. H. M.
    Gubbels, G. H. M.
    O'Halloran, O.
    Rongen, R.
    EMPC-2011: 18TH EUROPEAN MICROELECTRONICS & PACKAGING CONFERENCE, 2011,
  • [5] Characterization of intermetallic compounds in Cu-Al ball bonds: Mechanical properties, interface delamination and thermal conductivity
    Kouters, M. H. M.
    Gubbels, G. H. M.
    Ferreira, O. Dos Santos
    MICROELECTRONICS RELIABILITY, 2013, 53 (08) : 1068 - 1075
  • [6] Evaluation of the Corrosion Performance of Cu-Al Intermetallic Compounds and the Effect of Pd Addition
    Lim, Adeline B. Y.
    Neo, Wei Jian
    Yauw, Oranna
    Chylak, Bob
    Gan, Chee Lip
    Chen, Zhong
    2015 IEEE 17TH ELECTRONICS PACKAGING AND TECHNOLOGY CONFERENCE (EPTC), 2015,
  • [7] Characterization of intermetallic compounds in Cu-Al ball bonds: thermo-mechanical properties, interface delamination and corrosion
    Gubbels, G. H. M.
    Kouters, M. H. M.
    Ferreira, O. Dos Santos
    2012 4TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC), 2012,
  • [8] Evaluation of the corrosion performance of Cu-Al intermetallic compounds and the effect of Pd addition
    Lim, Adeline B. Y.
    Neo, Wei Jian
    Yauw, Oranna
    Chylak, Bob
    Gan, Chee Lip
    Chen, Zhong
    MICROELECTRONICS RELIABILITY, 2016, 56 : 155 - 161
  • [9] Effect of Cu-Al Ratio on Microstructure and Mechanical Properties of Cu-Al Alloys Prepared by Powder Metallurgy
    Wang, Yuze
    Wu, Zhiyuan
    Zuo, Lijie
    Zhang, Hongliang
    He, Yiqiang
    Luo, Yi
    Liu, Chang
    Qian, Zechen
    Zou, Changfang
    Yu, Hongmiao
    METALS, 2024, 14 (09)
  • [10] INVERSION DOMAINS AND THE MECHANICAL-PROPERTIES OF GAMMA-2 (CU-AL) INTERMETALLIC COMPOUND
    TORRESVILLASENOR, G
    AVALOSBORJA, M
    RADCLIFFE, SV
    METALLURGICAL TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 1979, 10 (03): : 384 - 387
12345