Modeling, design, fabrication, and characterization of Ultra-High bandwidth 3D glass photonic substrates

被引:0
|
作者
Chou, Bruce [1 ]
Vis, William [1 ]
Furuya, Ryuta [2 ]
Sundaram, Venky [1 ]
Tummala, Rao [1 ]
机构
[1] Georgia Institute of Technology, United States
[2] Ushio Incorporated, 813 Ferst Drive NW, Atlanta,GA,30332, United States
来源
Advancing Microelectronics | 2016年 / 43卷 / 04期
关键词
Moving mask lithography - Optoelectronic packaging - Passive alignment - Single mode waveguides - Single-mode optical waveguides - Single-step process - Ultra-high bandwidth - Vertical gratings;
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页码:12 / 16
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