Modeling, design, fabrication, and characterization of Ultra-High bandwidth 3D glass photonic substrates

被引:0
|
作者
Chou, Bruce [1 ]
Vis, William [1 ]
Furuya, Ryuta [2 ]
Sundaram, Venky [1 ]
Tummala, Rao [1 ]
机构
[1] Georgia Institute of Technology, United States
[2] Ushio Incorporated, 813 Ferst Drive NW, Atlanta,GA,30332, United States
来源
Advancing Microelectronics | 2016年 / 43卷 / 04期
关键词
Moving mask lithography - Optoelectronic packaging - Passive alignment - Single mode waveguides - Single-mode optical waveguides - Single-step process - Ultra-high bandwidth - Vertical gratings;
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
页码:12 / 16
相关论文
共 50 条
  • [1] Modeling, Design, and Fabrication of Ultra-high Bandwidth 3D Glass Photonics (3DGP) in Glass Interposers
    Chou, Bruce C.
    Sato, Yoichiro
    Sukumaran, Vijay
    Sun, Jibin
    Sundaram, Venky
    Chang, Gee-Kung
    Tummala, Rao
    2013 IEEE 63RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2013, : 286 - 291
  • [2] Modeling, Design, and Demonstration of Ultra-miniaturized and High Efficiency 3D Glass Photonic Modules
    Chou, Bruce C.
    Razdan, Sandeep
    Zhang, Haipeng
    Sun, Jibin
    Bowen, Terry
    Smet, Vanessa
    Chang, Gee-Kung
    Sundaram, Venky
    Tummala, Rao
    2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2014, : 1054 - 1059
  • [3] Rheological characterization of ultra-high performance concrete for 3D printing
    Arunothayan, Arun R.
    Nematollahi, Behzad
    Khayat, Kamal H.
    Ramesh, Akilesh
    Sanjayan, Jay G.
    CEMENT & CONCRETE COMPOSITES, 2023, 136
  • [4] Modeling, Design, Fabrication and Demonstration of RF Front-End 3D IPAC Module with Ultra-thin Glass Substrates for LTE Applications
    Min, Junki
    Wu, Zihan
    Pulugurtha, Markondeya Raj
    Smet, Vanessa
    Sundaram, Venky
    Tummala, Rao
    Ravindran, Arjun
    Hoffmann, Christian
    2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2016, : 1297 - 1302
  • [5] Fabrication and characterization of chirped 3D photonic crystals
    Gates, B
    Xia, YN
    ADVANCED MATERIALS, 2000, 12 (18) : 1329 - 1332
  • [6] Glass Interposer Substrates: Fabrication, Characterization and Modeling
    Keech, John
    Piech, Garrett
    Pollard, Scott
    Chaparala, Satish
    Shorey, Aric
    Wang, Bor Kai
    PROCEEDINGS OF THE 2013 IEEE 15TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC 2013), 2013, : 706 - 709
  • [7] Stochastic 3D modeling of Ostwald ripening at ultra-high volume fractions of the coarsening phase
    Spettl, A.
    Wimmer, R.
    Werz, T.
    Heinze, M.
    Odenbach, S.
    Krill, C. E., III
    Schmidt, V.
    MODELLING AND SIMULATION IN MATERIALS SCIENCE AND ENGINEERING, 2015, 23 (06)
  • [8] Ultra-High Resolution 3D Imaging of Whole Cells
    Huang, Fang
    Sirinakis, George
    Allgeyer, Edward S.
    Schroeder, Lena K.
    Duim, Whitney C.
    Kromann, Emil B.
    Phan, Thomy
    Rivera-Molina, Felix E.
    Myers, Jordan R.
    Irnov, Irnov
    Lessard, Mark
    Zhang, Yongdeng
    Handel, Mary Ann
    Jacobs-Wagner, Christine
    Lusk, C. Patrick
    Rothman, James E.
    Toomre, Derek
    Booth, Martin J.
    Bewersdorf, Joerg
    CELL, 2016, 166 (04) : 1028 - 1040
  • [9] Ultra-high resolution microwave photonic radar with post-bandwidth synthesis
    马丛
    陈浩
    叶星炜
    王祥传
    潘时龙
    Chinese Optics Letters, 2020, (07) : 102 - 106
  • [10] Ultra-high resolution microwave photonic radar with post-bandwidth synthesis
    Ma, Cong
    Chen, Hao
    Ye, Xingwei
    Wang, Xiangchuan
    Pan, Shilong
    CHINESE OPTICS LETTERS, 2020, 18 (07)