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- [1] Modeling, Design, and Fabrication of Ultra-high Bandwidth 3D Glass Photonics (3DGP) in Glass Interposers 2013 IEEE 63RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2013, : 286 - 291
- [2] Modeling, Design, and Demonstration of Ultra-miniaturized and High Efficiency 3D Glass Photonic Modules 2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2014, : 1054 - 1059
- [3] Rheological characterization of ultra-high performance concrete for 3D printing CEMENT & CONCRETE COMPOSITES, 2023, 136
- [4] Modeling, Design, Fabrication and Demonstration of RF Front-End 3D IPAC Module with Ultra-thin Glass Substrates for LTE Applications 2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2016, : 1297 - 1302
- [6] Glass Interposer Substrates: Fabrication, Characterization and Modeling PROCEEDINGS OF THE 2013 IEEE 15TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC 2013), 2013, : 706 - 709