Microstructure and performance of hot-dip aluminizing coating of copper

被引：0
|
作者：
School of Mechanical Engineering, University of Shanghai for Science and Technology, Shanghai [1 ]
200093, China
不详 [2 ]
200093, China
机构：
来源：
Xiyou Jinshu | / 10卷 / 955-960期
关键词：
Compendex;
D O I：
10.13373/j.cnki.cjrm.2015.10.015
中图分类号：
学科分类号：
摘要：
Scanning electron microscopy
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