Metallurgical aspects and problems with lead-containing solders

Moves to prohibit the use of lead-containing solders have triggered extensive research into development of lead-free solders for electronic assemblies. Such developments will almost certainly be fruitless without a sound knowledge and understanding of the metallurgical basis of candidate solder alloys. For electronic applications, the feasibility of electrodeposition of such alloys must also be considered, as well as factors relating to intrinsic cost of the component metals. Possible candidates, here compared with conventional lead-tin solders, are alloys of tin with antimony, cadmium, gold, indium, copper, silver, bismuth and zinc.