Full chip temperature optimization for considering thermal-electric coupling effects

被引：0
|
作者：
Leng, Peng [1 ]
Dong, Gang [1 ]
Chai, Chang-Chun [1 ]
Yang, Yin-Tang [1 ]
机构：
[1] Ministry of Education Key Lab. of Wide Band-Gap Semiconductor Materials and Devices, Xidian Univ., Xi'an 710071, China
来源：
Xi'an Dianzi Keji Daxue Xuebao/Journal of Xidian University | 2009年 / 36卷 / 06期
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页码：1053 / 1058
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