Interconnection of fine lines to micro vias in high density multilayer LTCC substrates

被引：0
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作者：
Ceramic Electronics Packaging Laboratory , Department of Electrical Engineering, University of Arkansas, 3217 Bell Engineering Center, Fayetteville, AR 72701, United States [1 ]
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来源：
International Microelectronics and Packaging Society (IMAPS) | 1600年 / 810-815卷 / 2005期
关键词：
Compendex;
D O I：
38th International Symposium on Microelectronics, IMAPS 2005
中图分类号：
学科分类号：
摘要：
Ceramic materials - Electric inductors - Microelectronics - Alignment - Multilayers - Integrated circuit interconnects - Chains - Silver - Coplanar waveguides - Temperature
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