Microstructure and properties of transient liquid-phase diffusion bonded joint of AZ31B/Cu dissimilar metal

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作者
Du, Shuang-Ming [1 ]
Liu, Gang [1 ]
Wang, Ming-Jing [1 ]
机构
[1] College of Materials Science and Engineering, Xi'an University of Science and Technology, Xi'an 710054, China
关键词
Copper alloys - Eutectics - Diffusion - Solid solutions - Microhardness - Aluminum alloys - Intermetallics - Grain boundaries - Dissimilar metals - Magnesium alloys - Binary alloys - Diffusion bonding - Metals - Liquids;
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页码:1255 / 1261
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