共 50 条
- [23] Orientation Relationships Among Sn/Cu6Sn5/Cu3Sn/(111)Cu in the Eutectic SnBi/(111)Cu Solder Joint 2010 11TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP), 2010, : 165 - 169
- [24] Nucleation and Growth of Electrodeposited Cobalt onto Si/Cu(111) substrate ELECTRODEPOSITION OF NANOENGINEERED MATERIALS AND DEVICES 3, 2010, 25 (41): : 135 - 148
- [26] Thermal Stability of Cu/Si (111) Films Prepared by Ionized Cluster Beam Technique APPLICATIONS OF ENGINEERING MATERIALS, PTS 1-4, 2011, 287-290 : 2369 - +
- [27] Phase Equilibria of the Sn–Ni–Si Ternary System and Interfacial Reactions in Sn–(Cu)/Ni–Si Couples Journal of Electronic Materials, 2015, 44 : 2422 - 2431
- [28] Kinetics of growth of intermetallics in the Cu-Sn system ZEITSCHRIFT FUR METALLKUNDE, 2002, 93 (06): : 516 - 522
- [30] The preferential growth of η-Cu6Sn5 on (111) uni-directional Cu pads 2012 7TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT), 2012,