Flip-chip vs. wirebond

被引:0
|
作者
Staiculescu, Daniela
Lim, Kyutae
Sutono, Albert
Liang, Hongwei
Tentzeris, Manos
Laskar, Joy
机构
来源
Printed Circuit Design | 2002年 / 19卷 / 06期
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
相关论文
共 50 条
  • [31] Processing mechanics for flip-chip assembly
    Wang, JJ
    Qian, ZF
    Liu, S
    MICROELECTRONIC PACKAGING AND LASER PROCESSING, 1997, 3184 : 22 - 29
  • [32] Flip-chip packaging for smart MEMS
    Mayer, F
    Ofner, G
    Koll, A
    Paul, O
    Baltes, H
    SMART STRUCTURES AND MATERIALS 1998: SMART ELECTRONICS AND MEMS, 1998, 3328 : 183 - 193
  • [33] Flip-chip assembly for photonic circuits
    Wörhoff, K
    Heideman, RG
    Gilde, MJ
    Blidegn, K
    Heschel, M
    van den Vlekkert, H
    MICRO-OPTICS: FABRICATION, PACKAGING, AND INTEGRATION, 2004, 5454 : 9 - 20
  • [34] Thermal characterization of flip-chip BGA
    Chen, HN
    Wu, CT
    Lin, PJ
    Hung, SC
    2000 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, 2000, 4339 : 357 - 361
  • [35] Anisotropic adhesives for flip-chip bonding
    Kivilahti, J
    Savolainen, P
    JOURNAL OF ELECTRONICS MANUFACTURING, 1995, 5 (04): : 245 - 252
  • [36] A routing algorithm for flip-chip design
    Fang, JW
    Lin, IJ
    Yuh, PH
    Chang, YW
    Wang, JH
    ICCAD-2005: INTERNATIONAL CONFERENCE ON COMPUTER AIDED DESIGN, DIGEST OF TECHNICAL PAPERS, 2005, : 753 - 758
  • [37] Flip-chip packaging reliability advances
    Alcoe, David
    Blackwell, Kim
    Laine, Eric
    Advanced Packaging, 2000, 9 (06):
  • [38] Double bump flip-chip assembly
    Yan, Kathy Wei
    Johnson, R. Wayne
    Stapleton, Russell
    Ghosh, Kalyan
    IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 2006, 29 (02): : 119 - 133
  • [39] Vibrations in the Flip-Chip Soldering Process
    Sylvestre, Julien
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2011, 1 (06): : 904 - 911
  • [40] FLIP-CHIP BONDING WITH SOLDER DIPPING
    BRADY, MJ
    DAVIDSON, A
    REVIEW OF SCIENTIFIC INSTRUMENTS, 1985, 56 (07): : 1459 - 1460