共 40 条
- [21] A new substrate enginieering technique to realize Silicon on Nothing (SON) structure utilizing transformation of sub-micron trenches to Empty Space in Silicon (ESS) by surface migration HIGH PURITY SILICON VI, 2000, 4218 : 532 - 545
- [22] Overcoming the Reliability Limitation in the Ultimately Scaled DRAM Using Silicon Migration Technique by Hydrogen Annealing 2017 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM), 2017,
- [24] Surface Patterning of Silicon and Germanium using Focused Ion Beam for the Development of FinFET Structure PROCEEDINGS OF THE 2019 IEEE REGIONAL SYMPOSIUM ON MICRO AND NANOELECTRONICS (RSM), 2019, : 116 - 118
- [26] Surface integrity and removal mechanism of chemical mechanical grinding of silicon wafers using a newly developed wheel The International Journal of Advanced Manufacturing Technology, 2016, 83 : 1231 - 1239
- [27] Surface integrity and removal mechanism of chemical mechanical grinding of silicon wafers using a newly developed wheel INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2016, 83 (5-8): : 1231 - 1239
- [28] Surface integrity and removal mechanism of chemical mechanical grinding of silicon wafers using a newly developed wheel Kang, Renke (kangrk@dlut.edu.cn), 1600, Springer London (83): : 5 - 8
- [29] PHYS 321-Efficient modeling of silicon and silicon oxide surface chemistry with electronic structure theory using pseudo-atoms ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 2006, 232
- [30] Surface micro-structure formed by rubbing with hard particles and its application to friction surfaces -surface modification of aluminum alloy plate by rubbing with silicon carbide particles and its fretting properties Toraibarojisuto/Journal of Japanese Society of Tribologists, 2009, 54 (02): : 130 - 137