Study on preparation of high thermal conductive adhesive for mica tape

被引：0
|
作者：
Liu, Li-Zhu [1 ,2 ]
Zhao, Chao-Liang [1 ]
Weng, Ling [1 ]
Yang, Xu [1 ]
He, Xin [3 ]
机构：
[1] College of Material Science and Engineering, Harbin University of Science and Technology, Harbin 150040, China
[2] Key Laboratory of Engineering Dielectric and Its Application, Ministry of Education, Harbin University of Science and Technology, Harbin 150040, China
[3] Harbin Electric Machinery Company Limited, Harbin 150040, China
来源：
Gongneng Cailiao/Journal of Functional Materials | 2012年 / 43卷 / 03期
关键词：
III-V semiconductors - Thermal conductivity - Epoxy resins - Surface treatment - Aluminum nitride - Dispersions - Mica;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Nano-AlN powder was added as fillers in the epoxy resin to increase the thermal conductivity. The effects of AlN surface modification and method of powder addition on the thermal conductivity of adhesive were analyzed. Through thermal conductivity test, surface modification of inorganic fillers was identified, and the optimal filler dispersion process was concluded, which involved the adding method, dispersion method, and mixing paremeters.
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页码：331 / 333
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