The continuous expansion of microelectromechanical systems (MEMS), and the huge investments made by the electronics community in silicon technology is discussed. The need to combine electronics and MEMS on the same chip improves the wear characteristics of moving parts and achieve a greater mass of moving parts. It is found that the need for biocompatibility in the emerging field of bio-MEMS has added urgency to the quest of new materials, since Si-based materials cannot meet-MEMS needs. Among the new MEMS materials that might solve the temperature problem include: polycrystalline germanium, polycrystalline silicon germanium and amorphous diamond films that can be formed in a stress free condition at much lower temperatures than polycrystalline Si.
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Arizona State Univ, Dept Psychol, Tempe, AZ 85287 USAArizona State Univ, Dept Psychol, Tempe, AZ 85287 USA
Corbin, William R.
Zalewski, Suzanne
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Arizona State Univ, Dept Psychol, Tempe, AZ 85287 USAArizona State Univ, Dept Psychol, Tempe, AZ 85287 USA
Zalewski, Suzanne
Leeman, Robert F.
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Yale Univ, Sch Med, New Haven, CT USAArizona State Univ, Dept Psychol, Tempe, AZ 85287 USA
Leeman, Robert F.
Toll, Benjamin A.
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Yale Univ, Sch Med, New Haven, CT USA
Smilow Canc Hosp Yale New Haven, New Haven, CT USA
Yale Univ, Sch Med, Yale Canc Ctr, New Haven, CT USAArizona State Univ, Dept Psychol, Tempe, AZ 85287 USA
Toll, Benjamin A.
Fucito, Lisa M.
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Yale Univ, Sch Med, New Haven, CT USAArizona State Univ, Dept Psychol, Tempe, AZ 85287 USA
Fucito, Lisa M.
O'Malley, Stephanie S.
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Yale Univ, Sch Med, New Haven, CT USA
Yale Univ, Sch Med, Yale Canc Ctr, New Haven, CT USAArizona State Univ, Dept Psychol, Tempe, AZ 85287 USA