The continuous expansion of microelectromechanical systems (MEMS), and the huge investments made by the electronics community in silicon technology is discussed. The need to combine electronics and MEMS on the same chip improves the wear characteristics of moving parts and achieve a greater mass of moving parts. It is found that the need for biocompatibility in the emerging field of bio-MEMS has added urgency to the quest of new materials, since Si-based materials cannot meet-MEMS needs. Among the new MEMS materials that might solve the temperature problem include: polycrystalline germanium, polycrystalline silicon germanium and amorphous diamond films that can be formed in a stress free condition at much lower temperatures than polycrystalline Si.