Leaching of copper residue with oxygen in sulfuric acid with participation of chloride

被引：0
|
作者：
Deng, T. [1 ]
Wen, Z. [1 ]
Liu, D. [1 ]
机构：
[1] Institute of Chemical Metallurgy, Chinese Academy of Sciences, Beijing 100080, China
来源：
Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals | 2001年 / 11卷 / 02期
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摘要：
Leaching of a copper residue, produced by selected oxidation leaching of a nickel matte, in oxygenated sulfuric acid solution with the participation of chloride was investigated. The leaching behaviors of copper and nickel in the copper residue were described. The effects of quantity of chloride, flowrate of oxygen, concentration of sulfuric acid and temperature were discussed as leaching variables. Addition of chloride in small amount into the leach slurry was justified in enhancing copper leaching from the residue.
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页码：302 / 306
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