Influence of rare earths, Ga element and their synergistic effects on the microstructure and properties of lead-free solders

被引：0
|
作者：
Xue P. [1 ]
He P. [2 ]
Long W. [3 ]
Song M. [4 ]
机构：
[1] Nanjing University of Science and Technology, Nanjing
[2] State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin
[3] State Key Laboratory of Advanced Brazing Filler Metals and Technology, China Innovation Academy of Intelligent Equipment Co., Ltd, Ningbo
[4] Dalian Shipbuilding Industry Equipment Manufacturing Co. LTD, Dalian
来源：
Hanjie Xuebao/Transactions of the China Welding Institution | 2021年 / 42卷 / 04期
关键词：
Ga element; Microstructure; Property; Rare earths; Synergistic effect;
D O I：
10.12073/j.hjxb.20200817001
中图分类号：
学科分类号：
摘要：
Rare earth (RE) elements and low melting-point Ga elements are often added as alloying elements to lead-free solders to improve the overall performance and reliability of the solder. When RE and Ga elements are added in combination, their synergistic effects can further improve the microstructure and properties of the solder. In particular, Ga element can effectively inhibit the growth of Sn whiskers in lead-free solders containing RE Nd. Therefore, this article reviewed the effects of RE, low melting-point Ga element and their synergistic effects on the microstructure, wettability, melting characteristics, mechanical properties and reliability of lead-free solders. What's more, the mechanism of Sn whiskers formation in lead-free solders bearing RE and the factors affecting the growth of Sn whiskers were introduced. Finally, the deficiencies in the research of lead-free solder containing RE and Ga elements were summarized, and the future research direction was looked-ahead. © 2021, Editorial Board of Transactions of the China Welding Institution, Magazine Agency Welding. All right reserved.
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页码：1 / 19
页数：18
相关论文
共 125 条
  • [51] Zhang Q K, Long W M, Yu X Q, Et al., Effects of Ga addition on microstructure and properties of Sn-Ag-Cu/Cu solder joints, Journal of Alloys and Compounds, 622, pp. 973-978, (2015)
  • [52] Xu J C, Xue S B, Luo D X, Et al., Effect of Ga on the inoxidizability and wettability of Sn-0.5Ag-0.7Cu-0.05Pr solder, Advances in Materials Science and Engineering, (2017)
  • [53] Liu N S, Lin K L., The effect of Ga content on the wetting reaction and interfacial morphology formed between Sn-8.55Zn-0.5Ag-0.1Al-xGa solders and Cu, Scripta Materialia, 54, 2, pp. 219-224, (2006)
  • [54] Kong Xiangxia, Sun Fenglian, Yang Miaosen, Et al., Effect of Bi and Ni concentration on the creep behavior of the bulks of Cu/SAC/Cu micro solder joints, Journal of Mechanical Engineering, 53, 2, pp. 53-60, (2017)
  • [55] Wang B, Xue S B, Wang J X, Et al., Effect of rare earth Pr on creep behavior of Sn-0.3Ag-0.7Cu-0.5Ga low-Ag solder alloys, Rare Metal Materials and Engineering, 47, 9, pp. 2657-2662, (2018)
  • [56] Pei M, Qu J M., Creep and fatigue behavior of SnAg solders with lanthanum doping, IEEE Transactions on Components and Packaging Technologies, 31, 3, pp. 712-718, (2008)
  • [57] Zhang L, Xue S B, Gao L L, Et al., Creep behavior of SnAgCu solders with rare earth Ce doping, Transactions of Nonferrous Metals Society of China, 20, 3, pp. 412-417, (2010)
  • [58] Shi Y W, Tian J, Hao H, Et al., Effects of small amount addition of rare earth Er on microstructure and property of SnAgCu solder, Journal of Alloys and Compounds, 453, 1, pp. 180-184, (2008)
  • [59] Nan X J, Xue S B, Zhai P Z, Et al., Effect of Pr addition on properties of Sn-0.5Ag-0.7Cu-0.5Ga lead-free solder, Journal of Electronic Materials, 45, 10, pp. 5443-5448, (2016)
  • [60] Shao Haobin, Zhang Ning, Shi Xiaodong, Et al., Effect of aging treatment on interfacial morphology of Sn0.7Cu-0.5Al<sub>2</sub>O<sub>3</sub>/Cu solder joint, Foundry Technology, 37, 9, pp. 1838-1841, (2016)
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