Preparation and Properties of Flexible Copper Clad Laminates Based-on Carboxylic Polyimide Copolymer

被引：0
|
作者：
Liu G. [1 ]
Liu R. [1 ]
Qu L. [1 ,2 ]
Tang H. [1 ]
Yang C. [1 ]
Li Y. [1 ]
机构：
[1] School of Materials Science and Engineering, Chongqing University of Technology, Chongqing
[2] Chongqing University Key Laboratory of Micro/Nano Materials Engineering and Technology, Chongqing University of Arts and Sciences, Chongqing
来源：
Gaofenzi Cailiao Kexue Yu Gongcheng/Polymeric Materials Science and Engineering | 2022年 / 38卷 / 03期
关键词：
Diaminobenzoic acid; Free flexible copper cladding laminates; Peel strength; Polyimide;
D O I：
10.16865/j.cnki.1000-7555.2022.0069
中图分类号：
学科分类号：
摘要：
A series of polyamides (PPA) were prepared by copolymerization using 4,4' -p-phenyldioxy phthalic anhydride (HQDPA), 4,4' -diaminodiphenyl ether (ODA) and 3, 5- diaminobenzoic acid (DABA), and coated on the surface of copper foil. The glue free flexible copper cladding laminates (FCCLs) were obtained by thermal- imide method. The results show that when the diamine is DABA, the polyimides (PIs) perform excellent mechanical and thermal properties. The surface contact angle of PI-5 is only 61.3°, and the coefficient of thermal expansion is 24×10-6 K-1, and the dielectric constant is 3.58, and the peel strength of the prepared FCCL reaches 1.18 N/mm. The performance of the carboxy-containing polyimide can meet the requirements of adhesive free flexible printed circuit for the dimensional stability and bonding properties of substrate membrane materials. © 2022, Editorial Board of Polymer Materials Science & Engineering. All right reserved.
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页码：32 / 39
页数：7
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