Encapusulation materials for power device packaging

被引：0
|
作者：
Ishii T. [1 ]
机构：
[1] Hitachi Astemo, Ltd., 2520 Hitachinaka-shi, Ibaraki
来源：
Journal of Japan Institute of Electronics Packaging | 2021年 / 24卷 / 05期
关键词：
D O I：
10.5104/jiep.24.449
中图分类号：
学科分类号：
摘要：
[No abstract available]
引用
收藏
页码：449 / 454
页数：5
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