Thermal Conductivity of Nano-boron Nitride Composite Film/Liquid Crystalline Epoxy Fiber

被引：0
|
作者：
Yang S. [1 ]
Huang Z. [1 ]
Zhang Y. [1 ]
Li J. [1 ]
Shang K. [1 ]
Wang H. [1 ]
机构：
[1] State Key Laboratory of Power Transmission Equipment & System Security and New Technology, School of Electrical Engineering, Chongqing University, Chongqing
来源：
Gaodianya Jishu/High Voltage Engineering | 2022年 / 48卷 / 09期
基金：
中国国家自然科学基金;
关键词：
boron nitride; breakdown strength; liquid crystal epoxy resin; nano cellulose; thermal conductivity;
D O I：
10.13336/j.1003-6520.hve.20211444
中图分类号：
学科分类号：
摘要：
The poor thermal conductivity and heat resistance of liquid crystalline epoxy resin make it difficult to dissipate heat during the operation of electric and electronic devices, and the rising temperature leads to the deterioration of epoxy resin insulation, which greatly impairs the reliability and life of electric and electronic devices. The electrospinning method and process for preparing high orientation liquid crystalline epoxy fiber thin films were developed in this paper. Nano boron nitride (BNNSs) was filled into the fiber films by vacuum filtration method, and thermal-conductive thin films which were filled with the oriented nano boron nitride/liquid crystalline epoxy fiber composite were further prepared. The effects of liquid crystalline epoxy fiber diameter and nano boron nitride filling concentration on the thermal properties and the AC breakdown strength of BNNSs/liquid crystal epoxy resin composite films were studied. The results show that the in-plane thermal conductivity of liquid crystalline epoxy resin fiber film increases with the decrease of fiber diameter. When the fiber diameter decreases to 280 nm, the thermal conductivity is 0.699 W/(m·K). When the BNNSs thermal conductive filler is filled, the in-plane thermal conductivity of BNNSs/liquid crystalline epoxy resin thermal conductive composite film increases sharply with the increase of filler concentration. When the filler content is 15%, the in-plane thermal conductivity can reach 5.88 W/(m·K), which is 779% higher than that of diameter. At the same time, it is found that the AC breakdown strength of the liquid crystalline epoxy resin fiber film is high when the diameter is small, and the breakdown strength of the 280 nm fiber film is 26.55 kV/mm. The addition of BNNSs thermal conductive filler can reduce the thermal breakdown of the film composite. When the filler content is 10%, the power frequency breakdown strength increases most significantly, which increases by nearly 11%, reaching 29.47 kV/mm. Therefore, it is demonstrated that BNNSs-filled liquid crystal epoxy resin composite film materials can significantly enhance thermal conductivity while maintaining excellent electrical insulation properties. © 2022 Science Press. All rights reserved.
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页码：3551 / 3562
页数：11
相关论文
共 28 条
  • [1] LI Yafeng, YAO Xueling, SUN Jinru, Et al., Hydrothermal aging characteristics of cured epoxy resin for insulation encapsulation, High Voltage Engineering, 47, 10, pp. 3600-3607, (2021)
  • [2] WANG Tianyu, LI Dayu, HOU Yicen, Et al., Suppression of surface charge accumulation of epoxy resin nanocomposites by SiO<sub>2</sub> nano-particle surface grafting, High Voltage Engineering, 46, 12, pp. 4129-4137, (2020)
  • [3] ZHANG Xiaoxing, HU Guoxiong, WU Yunjian, Et al., Study on the thermal and dielectric properties of epoxy resin modified by boron nitride nanosheets, High Voltage Engineering, 47, 2, pp. 645-651, (2021)
  • [4] YAN Shuangshuang, LI Yuanyuan, TIAN Muqin, Et al., Growth characteristics of electrical trees in epoxy resin-based nano-SiO<sub>2</sub> composites with different filler concentrations, High Voltage Engineering, 45, 12, pp. 3860-3868, (2019)
  • [5] REN L L, LI Q, LU J B, Et al., Enhanced thermal conductivity for Ag-deposited alumina sphere/epoxy resin composites through manipulating interfacial thermal resistance, Composites Part A: Applied Science and Manufacturing, 107, pp. 561-569, (2018)
  • [6] SU Jiang, Research advances in the liquid-crystalline epoxy resins, Thermosetting Resin, 31, 1, pp. 56-62, (2016)
  • [7] TAKEZAWA Y, AKATSUKA M, FARREN C., High thermal conductive epoxy resins with controlled high order structure, Proceedings of the 7th International Conference on Properties and Applications of Dielectric Materials (Cat. No. 03CH37417), pp. 1146-1149, (2003)
  • [8] FUKUSHIMA K, TAKAHASHI H, TAKEZAWA Y, Et al., High thermal conductive resin composites with controlled nanostructures high thermal conductive resin composites with controlled, IEEJ Transactions on Fundamentals and Materials, 126, 11, pp. 1167-1172, (2006)
  • [9] KAWAMOTO S, FUJIWARA H, NISHIMURA S., Hydrogen characteristics and ordered structure of mono-mesogen type liquid-crystalline epoxy polymer, International Journal of Hydrogen Energy, 41, 18, pp. 7500-7510, (2016)
  • [10] ISLAM A M, LIM H, YOU N H, Et al., Enhanced thermal conductivity of liquid crystalline epoxy resin using controlled linear polymerization, ACS Macro Letters, 7, 10, pp. 1180-1185, (2018)
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