Points to Consider in Measuring Thermal Conductivity of Heat-Dissipating Materials

被引：0
|
作者：
Miyake S. [1 ]
Ohtsuki T. [2 ]
Hatori K. [2 ]
机构：
[1] Department of Mechanical Engineering, Kobe City College of Technology, 8-3 Gakuenhigashi-machi, Nishi-ku, Hyogo, Kobe-shi
[2] Hudson Laboratory, Bethel Co., Ltd., 4-3-18 Tsuchiura brick Bld. 1F Sakura-machi, Ibaraki, Tsuchiura-shi
来源：
Journal of Japan Institute of Electronics Packaging | 2023年 / 26卷 / 05期
关键词：
D O I：
10.5104/JIEP.26.420
中图分类号：
学科分类号：
摘要：
[No abstract available]
引用
收藏
页码：420 / 426
页数：6
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