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- [41] Welcome Message from Wei-Chung Lo, Conference Co-Chair Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT, 2022, 2022-October
- [42] Welcome Message from Chih-I Wu, Conference Co-Chair Wu, Chih-I, 1600, IEEE Computer Society (2021-December):
- [43] Welcome Message from Wei-Chung Lo, Conference Co-Chair Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT, 2021, 2021-December
- [44] Welcome message from Ming-Yi Tsai, conference co-chair Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT, 2019, 2018-October
- [45] Welcome message from Dr. CT Liu, conference co-chair Liu, C.T., 2013, IEEE Computer Society, 2001 L Street N.W., Suite 700, Washington, DC 20036-4928, United States
- [46] Welcome message from Gin-Kou Ma, conference co-chair International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings, 2010,
- [47] Welcome Message from Shih-Chieh Chang, Conference Co-Chair Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT, 2023,
- [48] Welcome Message from Shin-Puu Jeng, Conference Co-Chair Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT, 2024,
- [49] Welcome Message from Conference Co-Chair Chih-I Wu Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT, 2016,
- [50] Welcome message from Dr. CT Liu, Conference Co-Chair 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings, 2014,