New architectures and materials for electronic packaging

被引：0
|
作者：
Mena-Garcia, Javier [1 ]
机构：
[1] The Pennsylvania State University, United States
来源：
American Ceramic Society Bulletin | 2024年 / 103卷 / 05期
关键词：
Packaging materials;
D O I：
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中图分类号：
学科分类号：
摘要：
It can be difficult to imagine our daily routine without the electronic devices and gadgets that enable everything from our energy infrastructures to transportation systems to communication networks. The importance of electronics to modern life is recognized by the outpouring of funding and initiatives in recent years to support the manufacture of semiconductor chips,1 which form the heart of today’s electronics.
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