Productization for Heatproof Embedded Substrate with Sn-Sb High Melting Point Solder Attachment

被引：0
|
作者：
Toda M. [1 ]
机构：
[1] Technology Research and Analytics Office, MEIKO ELECTRONICS CO., LTD., 5-14-15, Ogami, Ayase-shi, Kanagawa
来源：
Journal of Japan Institute of Electronics Packaging | 2023年 / 26卷 / 07期
关键词：
Compilation and indexing terms; Copyright 2024 Elsevier Inc;
D O I：
10.5104/JIEP.26.650
中图分类号：
学科分类号：
摘要：
[No abstract available]
引用
收藏
页码：650 / 656
页数：6
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