Rotary dressing and cylindrical grinding simulation for lead pattern prediction

被引：0
|
作者：
Garcia, M. [1 ]
Alvarez, J. [1 ]
Pombo, I. [2 ]
Barrenetxea, D. [1 ,2 ]
机构：
[1] Basque Res & Technol Alliance BRTA, Ideko Ctr Tecnol, Elgoibar, Basque Country, Spain
[2] Univ Basque Country UPV EHU, Fac Ind Engn, Bilbao, Spain
来源：
CIRP ANNALS-MANUFACTURING TECHNOLOGY | 2024年 / 73卷 / 01期
关键词：
Grinding; Simulation; Lead;
D O I：
10.1016/j.cirp.2024.04.038
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
A kinematic model of rotary dressing - cylindrical grinding for lead pattern prediction is presented. Analysis of dressing and grinding parameters, dressing forces, and wheel imbalance effects has been conducted, providing a comprehensive look at the interrelationships between them and the resulting lead pattern. For model validation, a series of experimental tests has been performed, where workpiece and simulation lead has been characterized according to MBN 31,007-7 standard. Results emphasize the significance of modelling and translate it into a useful tool for selecting optimal dressing and grinding parameters for achieving specific surface qualities where lead is minimised or eliminated. (c) 2024 CIRP. Published by Elsevier Ltd. All rights reserved.
引用
收藏
页码：249 / 252
页数：4
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