Guest Editorial Special Section on Ultrawide/Wide Bandgap Device, Packaging, Control, EMI, and Applications for Power Electronics

被引：0
|
作者：
Mazumder, Sudip K. [1 ]
Shen, John [2 ]
Wang, Shuo [3 ]
机构：
[1] Univ Illinois, Chicago, IL 60607 USA
[2] Simon Fraser Univ, Sch Mechatron Syst Engn, Burnaby, BC V5A 1S6, Canada
[3] Univ Florida, Dept Elect & Comp Engn, Gainesville, FL 32611 USA
来源：
IEEE TRANSACTIONS ON POWER ELECTRONICS | 2024年 / 39卷 / 10期
关键词：
Special issues and sections; Ultra wideband technology; Packaging; Control systems; Photonic band gap; Electromagnetic interference; Semiconductor device manufacture;
D O I：
10.1109/TPEL.2024.3440347
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：12542 / 12544
页数：3
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