Sandwich-structured electrospun polyvinylidene difluoride sensor for structural health monitoring of glass fiber reinforced polymer composites

Stress monitoring and interlaminar failure detection attract much attention in glass fiber reinforced polymer (GFRP) structural health monitoring area. However, due to limitations of sensing or electrode materials, existing embedding sensors cannot be designed to have both of the abilities without sacrificing mechanical properties. This work fabricated a sandwich-structured sensor, which is composed of three layers of electrospun polyvinylidene difluoride membranes. The upper and lower electrodes are flexible membranes that ensure stable signal collection in the rigid GFRP material system. The sensor can quantitatively monitor the stress based on piezoelectric effect, and interlaminar crack propagation based on parallel plate capacitors. The voltage and capacitance values have a linear relationship with the stress level and crack length (R-square of the functions is 0.999 and 0.933), respectively. Due to the porous microstructure of electrospun membranes, polymer matric can well infiltrate the polyvinylidene difluoride nanofibers while preparing the sensor embedded GFRP. Thus, the perfect bonding of the sensor within GFRP ensures the effective sensing abilities until sample failure and negligible effect (<-7%) on the mechanical properties of GFRP.