Extending Electrostatic Modeling for Schottky p-GaN Gate HEMTs: Uniform and Engineered p-GaN Doping

被引:0
|
作者
Alaei, Mojtaba [1 ,2 ]
Borga, Matteo [3 ]
Fabris, Elena [3 ]
Decoutere, Stefaan [3 ]
Lauwaert, Johan [4 ]
Bakeroot, Benoit [1 ,2 ]
机构
[1] Univ Ghent, Ctr Microsyst Technol CMST, B-9052 Ghent, Belgium
[2] Univ Ghent, Interuniv Microelect Ctr IMEC, B-9052 Ghent, Belgium
[3] Interuniv Microelect Ctr IMEC, B-3001 Leuven, Belgium
[4] Univ Ghent, Liquid Crystals & Photon Grp LCP, B-9052 Ghent, Belgium
关键词
MODFETs; HEMTs; Logic gates; Mathematical models; Wide band gap semiconductors; Aluminum gallium nitride; Semiconductor process modeling; Barrier voltage; breakdown; forward bias gate leakage current; junction voltage; p-GaN doping engineering; p-GaN gate HEMTs; uniform p-GaN doping; AVALANCHE BREAKDOWN VOLTAGE; THRESHOLD VOLTAGE; DENSITY;
D O I
10.1109/TED.2024.3446488
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This article presents a comprehensive analytical framework for modeling p-GaN gate high-electron-mobility transistors (HEMTs) based on rigorous solution of the Poisson and Schrodinger equations. It focuses primarily on the calculation of the 2-D electron gas (2DEG), voltage variation across the junction (Delta V-j), and AlGaN barrier ( Delta V-b) for the entire range of forward gate bias until gate breakdown. Our model considers the impact of AlGaN barrier height saturation. In addition, we demonstrate our model with the engineered p-GaN doping profile that yields higher forward gate breakdown voltages. Gate capacitance and breakdown voltage have been modeled for both uniform and engineered p-GaN doping profiles. The viability and accuracy of the proposed model are demonstrated through comparisons with empirical measurement data and TCAD simulations.
引用
收藏
页码:5949 / 5955
页数:7
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