Localized surface roughening to improve adhesion of electroless seed layer in through-glass vias

This article reports the improvement of the adhesion of the electroless seed layer deposited on glass substrates used in creating through-glass vias (TGV) by localized surface roughening. Four glass substrates having varying roughness characteristics were prepared by electrochemical discharge machining (ECDM) and ultrasonic machining (USM). The electroless nickel seed layer was deposited directly on glass without any adhesion layer, followed by electrodeposited copper layers. In-depth surface topography and morphology analysis reveal the mechanism behind the improved adhesion during standard peel and cross-hatch adhesion tests, which were used to determine the interlayer adhesion. Localized roughening techniques generated specific microfeatures, i.e., microgrooves (in USM) or ridges (in ECDM), increasing the surface area. These features acted as interlocking/nucleation sites to hold the electroless nickel atoms, resulting in higher interfacial adhesion. USM-roughened samples exhibited stronger interfacial adhesion than their ECDM-roughened counterparts, which indicated that the interlayer adhesion depends on topography and the roughened surface's morphology. The surface with negative skewness and positive excess kurtosis promotes mechanical interlocking, offering a promising strategy for enhancing interlayer adhesion. Finally, conformal deposition in a 6 x 6 array of through-holes having an aspect ratio of similar to 4 was also demonstrated.