Ultrasonic-assisted surface roughening of glass substrate to improve adhesion of electroless nickel seed layer in microsystems packaging

被引：0

|

作者：

Bajpai, Vishnu Kant ^{[1
]}

Pandey, Harsh ^{[1
]}

Singh, Tarlochan ^{[1
]}

Dixit, Pradeep ^{[1
]}

机构：

[1] Electrochemical Microfabrication Laboratory, Department of Mechanical Engineering, Indian Institute of Technology Bombay, 400076, India

来源：

Materials Letters | 2022年 / 316卷

关键词：

Glass substrates;

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[1] Ultrasonic-assisted surface roughening of glass substrate to improve adhesion of electroless nickel seed layer in microsystems packaging
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