Design and thermal simulation of the front-end module for STARLIGHT

被引:0
|
作者
Wang, Han [1 ]
Peng, Peng [1 ]
Zhang, Jie [2 ,3 ]
Liu, Peng [1 ]
Liu, Fang [1 ]
Li, Wei [1 ]
Ju, Xudong [1 ]
Sun, Tao [4 ]
Sheng, Zhen [4 ]
Liu, Zhi [1 ]
机构
[1] ShanghaiTech Univ, Ctr Transformat Sci, 393 Middle Huaxia Rd, Shanghai 201210, Peoples R China
[2] Chinese Acad Sci, Inst High Energy Phys, State Key Lab Particle Detect & Elect, 19B Yuquan Rd, Beijing 100049, Peoples R China
[3] Univ Chinese Acad Sci, Sch Phys Sci, 19A Yuquan Rd, Beijing 101408, Peoples R China
[4] Chinese Acad Sci, Shanghai Inst Microsyst & Informat Technol, 865 Changning Rd, Shanghai 200050, Peoples R China
基金
中国国家自然科学基金;
关键词
Thermal simulation; Front-end module; STARLIGHT;
D O I
10.1016/j.nima.2024.169676
中图分类号
TH7 [仪器、仪表];
学科分类号
0804 ; 080401 ; 081102 ;
摘要
This paper presents a front-end module emulator for SemiconducTor Array detectoR with Large dynamIc ranGe and cHarge inTegrating readout (STARLIGHT), a versatile hybrid silicon pixel detector with a high frame rate (>= 10kHz) and serving as the first charge-integrating pixel detector for XFEL in China. The detector is intended for operation in a vacuum environment, with the front-end module generating a thermal power of up to 5.443 mW/mm2, 2 , presenting a significant challenge for thermal management. To assess the thermal management capabilities of the mechanical and PCB designs for the project, a thermal emulator was developed to replicate the heat generated by the ASIC. This was particularly crucial during the early stages of the project when the ASIC was not yet available, achieved by placing copper wires on the PCB. Subsequent thermal simulations were conducted and compared with the results obtained from the thermal emulator. The comparison shows that the experimental results are very close to the thermal simulation results, validating the thermal performance of the STARLIGHT front-end modules. These endeavors not only provide validation but also offer valuable insights to ensure the thermal efficiency of the STARLIGHT front-end modules.
引用
收藏
页数:3
相关论文
共 50 条
  • [31] A Virtual Reality Front-End for Earthquake Simulation
    Lluis Fita, Josep
    Gustavo Patow, Gonzalo Besuievskyand
    XXIX SPANISH COMPUTER GRAPHICS CONFERENCE (CEIG19), 2019, : 59 - 67
  • [32] Atomistic Simulation Techniques in Front-End Processing
    Marques, Luis A.
    Pelaz, Lourdes
    Santos, Ivan
    Lopez, Pedro
    Aboy, Maria
    DOPING ENGINEERING FOR FRONT-END PROCESSING, 2008, 1070 : 237 - 248
  • [33] A low power analog front-end module for cochlear implants
    Wang, RJW
    Sarpeshkar, R
    Jabri, M
    Mead, C
    COCHLEAR IMPLANTS, 1996, : 75 - 79
  • [34] MONOLITHIC MEMS FILTER BANKS ON RFSOI FRONT-END MODULE
    Campanella, Humberto
    Qian, You
    Romero, Christian O.
    Giner, Joan
    Kumar, Rakesh
    2020 33RD IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS (MEMS 2020), 2020, : 218 - 221
  • [36] The Front-end Radiation Signal Detection Module Based on CdZnTe
    Zhang, Hao
    Ren, Wanchun
    Zhu, Hao
    Hama, Youji
    Ge, Xingyi
    Shi, LinLi
    PROCEEDINGS OF THE 32ND 2020 CHINESE CONTROL AND DECISION CONFERENCE (CCDC 2020), 2020, : 1257 - 1261
  • [37] Passive Components Design Based on LTCC Technology for Front-End Module in Ka-Band
    Shi, Jie
    Zhou, Yujin
    Zhou, Jun
    Shen, Ya
    2019 IEEE INTERNATIONAL SYMPOSIUM ON RADIO-FREQUENCY INTEGRATION TECHNOLOGY (RFIT2019), 2019,
  • [38] Design of an LTCC integrated tri-band direct conversion receiver front-end module
    Lucero, R
    Pavio, A
    Penunuri, D
    Bost, J
    2002 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST, VOLS 1-3, 2002, : 1545 - 1548
  • [39] An EEG Analog Front-End Design with Wireless Communication Module for a Portable EEG Monitoring System
    Chen, Wei-Chen
    Chen, Yi-Chung
    Chou, Chia-Ching
    Fang, Wai-Chi
    2015 IEEE 5TH INTERNATIONAL CONFERENCE ON CONSUMER ELECTRONICS - BERLIN (ICCE-BERLIN), 2015, : 50 - 51
  • [40] Analog front-end macro circuit design
    Univ of Illinois, Urbana, United States
    Int Symp VLSI Technol Syst Appl Proc, (223-226):