Anisotropically enhanced thermal conductivity of polymer composites based on segregated nanocarbon networks

被引:1
|
作者
Yoo, Gyun Young [1 ]
Kim, Ki Hoon [1 ]
Jung, Yong Chae [3 ]
Lee, Hunsu [3 ]
Kim, Seong Yun [1 ,2 ]
机构
[1] Jeonbuk Natl Univ, Dept Carbon Composites Convergence Mat Engn, 567 Baekje Daero, Jeonju Si 54896, Jeonbuk, South Korea
[2] Jeonbuk Natl Univ, Dept Organ Mat & Text Engn, 567 Baekje Daero, Jeonju 54896, Jeonbuk, South Korea
[3] Korea Inst Sci & Technol KIST, Inst Adv Composite Mat, 92 Chudong Ro, Wonju 55324, Jeonrabuk Do, South Korea
关键词
Segregated composites; Thermal conductivity; Electrical conductivity; Internal structure; MECHANISMS; FILLER;
D O I
10.1007/s42823-024-00799-x
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
Segregated composites, where fillers are selectively placed at the matrix interface to form a segregated filler network, are attracting attention because they can provide excellent conductive properties at low filler content. In this study, the anisotropic enhancement in thermal conductivity of composites was discovered due to the unique structure of the segregated network. The segregated composites were produced using a typical mechanical mixing of matrix pellets and the internal structure was precisely analyzed using three-dimensional non-destructive analysis. The segregated composites slightly improved in the through-plane thermal conductivity, but the in-plane thermal conductivity increased rapidly, showing the anisotropic thermal conductivity. The maximum improvement in the in-plane thermal conductivity of the segregated composites increased by 112.5 (at 7 wt% graphene nanoplatelet) and 71.4% (at 10 wt% multi-walled carbon nanotube), respectively, compared to that of the random composites filled with the same amount of filler. On the other hand, the electrical conductivity of the segregated composites was isotropic due to the difference in the transport mechanisms of electrons and phonons. The anisotropic thermal conductivity developed by the segregated network was helpful in inducing effective heat dissipation of commercial smartphone logic boards.
引用
收藏
页码:321 / 329
页数:9
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