High-power and efficiency W-band InAlGaN/AlN/GaN high-electron-mobility transistors for future high-capacity wireless communications

被引:3
|
作者
Kumazaki, Yusuke [1 ]
Ozaki, Shiro [1 ]
Nakasha, Yasuhiro [1 ]
Okamoto, Naoya [1 ]
Yamada, Atsushi [1 ]
Ohki, Toshihiro [1 ]
机构
[1] Fujitsu Ltd, Kawasaki, Kanagawa 2118588, Japan
关键词
GaN; HEMT; 6G; sub-terahertz; TECHNOLOGIES;
D O I
10.35848/1882-0786/ad68c2
中图分类号
O59 [应用物理学];
学科分类号
摘要
This study describes high-power and high-efficiency W-band InAlGaN/AlN/GaN high-electron-mobility transistors (HEMTs) for future sub-terahertz wireless communications. A low-thermal-budget selective-area growth (SAG) process was developed to obtain low contact resistance with low trap states. Transmission lines and substrate structures were optimized to obtain high-thermal conductivity and low substrate resonance. Consequently, a high output power of 28.7 dBm (742 mW), output power density of 4.6 W mm-1, and power-added efficiency (PAE) of 28.0% were achieved with pre-matched InAlGaN/AlN/GaN HEMTs at 90 GHz, which were superior combination of output power and PAE compared to the conventional high-temperature SAG process.
引用
收藏
页数:3
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