共 50 条
- [31] Development of one-stop machining system for φ300mm silicon wafer PROCEEDINGS OF THE FIFTEENTH ANNUAL MEETING OF THE AMERICAN SOCIETY FOR PRECISION ENGINEERING, 2000, : 140 - 143
- [32] Effect of thermal shield and gas flow on thermal elastic stresses in 300 mm silicon crystal RARE METALS, 2006, 25 : 45 - 50
- [33] Development of national Skill Standards for technicians working in highly automated (300mm) environments 2002 IEEE/SEMI ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE AND WORKSHOP: ADVANCING THE SCIENCE OF SEMICONDUCTOR MANUFACTURING EXCELLENCE, 2002, : 231 - 233
- [34] New wafer shape measurement technique for 300mm blank vertically held silicon wafers PHOTONIC INSTRUMENTATION ENGINEERING X, 2023, 12428
- [35] A Thermal Performance Measurement Method for Blind Through Silicon Vias (TSVs) in a 300mm Wafer 2011 IEEE 61ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2011, : 1204 - 1210
- [36] AIM Process Design Kit (AIMPDKv2.0): Silicon Photonics Passive and Active Component Libraries on a 300mm Wafer 2018 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXPOSITION (OFC), 2018,
- [38] 3D Printed Assembly and Software Development for Silicon Photonics Sensor Device Measurement FOURTH INTERNATIONAL CONFERENCE ON PHOTONICS SOLUTIONS (ICPS2019), 2020, 11331