Towards understanding the machining process in grinding of ceramic matrix composites: A review

被引:9
|
作者
Ran, Yichuan [1 ]
Sun, Jiansong [1 ]
Kang, Renke [1 ]
Dong, Zhigang [1 ]
Bao, Yan [1 ]
机构
[1] Dalian Univ Technol, State Key Lab High Performance Precis Mfg, Dalian 116024, Peoples R China
关键词
Ceramic -matrix composites (CMCs); Surface analysis; Machining; Grinding damage suppression; C/C-SIC COMPOSITES; CUTTING FORCE MODEL; MATERIAL REMOVAL; C/SIC COMPOSITES; ULTRASONIC VIBRATION; WOVEN COMPOSITES; FIBER FRACTURE; MECHANISM; BEHAVIOR; MICRO;
D O I
10.1016/j.compositesb.2024.111657
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The challenge of machining ceramic matrix composites (CMCs) arises from their hard and brittle, anisotropic, and heterogeneous nature, making them prone to damage such as edge chipping, fiber fracture, and interfacial debonding during grinding. To gain a thorough understanding of CMCs' grinding performance, this paper discusses in detail the removal behavior under the action of abrasive grain, focusing on the micro-interaction of abrasive grain and material. Following this analysis, various strategies for modeling grinding forces are elaborated. Then, we outline the quality evaluation of CMCs and offer solutions to mitigate grinding damage by comprehensively assessing the factors affecting material removal in CMCs. Ultimately, the prospects and potential advancements in the application of grinding processes for CMCs are highlighted.
引用
收藏
页数:25
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