Real-time etching process monitoring and end-point detection with a time-of-flight mass spectrometer

被引：0
|
作者：
Gasc, Sebastien [1 ]
Binda, Federico [1 ]
Das Kanungo, Pratyush [1 ]
Hofer, Lukas [1 ]
Rothenberger, Maximilian [1 ]
机构：
[1] Spacetek Technol AG, Bruggliweg 18, Gumlingen, Switzerland
来源：
2024 35TH ANNUAL SEMI ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE, ASMC | 2024年
关键词：
real-time process monitoring; time-of-flight mass spectrometry; dry etching; endpoint detection;
D O I：
10.1109/ASMC61125.2024.10545445
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
This study shows the capabilities of a time-of-flight mass spectrometer to monitor etching processes in real time. The experiments described in this work involve SiO2 etching using CHF3 and SF6 gases, and the results demonstrate the capability of the instrument to detect etching endpoints and track relevant species during the process.
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页数：4
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