Evaluation of the influence of the reliability application of a thermal insulation adhesive on the reliability of solder joints

Based on the reliability application requirements of space borne products for thermal insulation adhesives, the impact evaluation of two-component thermal insulation adhesives on the reliability of BGA solder joints was carried out. Through the design and manufacture of the typical BGA daisy chain network structure test piece of the satellite terminal machine, and the filling of thermal insulation adhesive, carry out the identification level environmental and reliability tests of the daisy chain test piece such as temperature cycle, sinusoidal vibration, random vibration and thermal vacuum, monitor the test process, and analyze the resistance data of the daisy chain network structure circuit. The resistance of the environmental test process is not increased, interrupted, and there is no solder joint failure and fracture; The daisy chain test piece has no defects introduced in the process of filling the thermal insulation adhesive. The thermal insulation adhesive has no effect on the solder joint of the daisy chain structure. It has the ability to withstand the environmental stress of the space-borne product, meet the requirements of heat dissipation and high load resistance of the space-borne product, and achieve reliable application.