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- [44] Large-area Die Attachment and the Surface Finish Effect on Bonding Strength of Joints in High-power Electronics Using a Low-temperature Sinterable Cu Nanoparticle Paste 2022 23RD INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2022,
- [47] Preparation of low-temperature sintered high conductivity inks based on nanosilver self-assembled on surface of graphene基于纳米银在石墨烯表面自组装制备低温固化高导电纳米银墨水 Journal of Central South University, 2019, 26 : 2953 - 2960