In order to improve the trade-off between the 4H-SiC planar Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) and super junction MOSFET (SJ-MOSFET), particularly on the drain to source capacitance (C-ds) which affects the switching performance, this study investigates the C-ds of the quasi SJ-MOSFETs with various P-pillar widths, depths, and concentrations. The measured results show (1) when the N-type region between the P-pillars (Epi-1 region) is fully depleted, the C-ds value abruptly drops, (2) when the N-type drift region beneath the P-pillar (Epi-2 region) is fully depleted, the slope of the C-ds-V-ds curve slowly changes because of the small extension of the depletion region in the P-type region. This is because the wider P-pillar width will increase the magnitude of the abrupt drop of the C-ds and make the drop occur earlier; the abrupt drop of the C-ds will occur later and the magnitude increases when the P-pillar depth is deeper due to the larger P-type region; Moreover, increasing the P-pillar concentration not only initiates the abrupt drop earlier and increases the magnitude, but also increases the minimum saturation value of the C-ds at a higher reverse bias. This study also reveals that the mechanism of the C-ds formation in a quasi SJ-MOSFET is different from the planar MOSFET and SJ-MOSFET. Finally, the simulated results are used to validate the influence of the P-pillar structures on the C-ds - V-ds curves in a quasi SJ-MOSFET.
机构:
State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China
Xiaorong Luo
Tian Liao
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State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China
Tian Liao
Jie Wei
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State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China
Jie Wei
Jian Fang
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State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China
Jian Fang
Fei Yang
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机构:
Global Energy Interconnection Research State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China
Fei Yang
Bo Zhang
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State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China
机构:
Italian Natl Res Council CNR, Inst Microelect & Microsyst IMM HQ, I-95121 Catania, ItalyItalian Natl Res Council CNR, Inst Microelect & Microsyst IMM HQ, I-95121 Catania, Italy
Sciuto, Antonella
Calcagno, Lucia
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Univ Catania, Phys Dept, I-95123 Catania, ItalyItalian Natl Res Council CNR, Inst Microelect & Microsyst IMM HQ, I-95121 Catania, Italy
Calcagno, Lucia
Mazzillo, Massimo
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STMicroelectronics, I-95121 Catania, ItalyItalian Natl Res Council CNR, Inst Microelect & Microsyst IMM HQ, I-95121 Catania, Italy
Mazzillo, Massimo
Mello, Domenico
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STMicroelectronics, I-95121 Catania, ItalyItalian Natl Res Council CNR, Inst Microelect & Microsyst IMM HQ, I-95121 Catania, Italy
Mello, Domenico
Barbarino, Pietro Paolo
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STMicroelectronics, I-95121 Catania, ItalyItalian Natl Res Council CNR, Inst Microelect & Microsyst IMM HQ, I-95121 Catania, Italy
Barbarino, Pietro Paolo
Zimbone, Massimo
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Italian Natl Res Council CNR, Inst Microelect & Microsyst IMM, I-95123 Catania, ItalyItalian Natl Res Council CNR, Inst Microelect & Microsyst IMM HQ, I-95121 Catania, Italy
Zimbone, Massimo
D'Arrigo, Giuseppe
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Italian Natl Res Council CNR, Inst Microelect & Microsyst IMM HQ, I-95121 Catania, ItalyItalian Natl Res Council CNR, Inst Microelect & Microsyst IMM HQ, I-95121 Catania, Italy
机构:
Hitachi Ltd, Res & Dev Grp, Higashi Koigakubo 1-280, Kokubunji, Tokyo 1858601, JapanHitachi Ltd, Res & Dev Grp, Higashi Koigakubo 1-280, Kokubunji, Tokyo 1858601, Japan
Sato, Shintaroh
Kobayashi, Keisuke
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Hitachi Ltd, Res & Dev Grp, Higashi Koigakubo 1-280, Kokubunji, Tokyo 1858601, JapanHitachi Ltd, Res & Dev Grp, Higashi Koigakubo 1-280, Kokubunji, Tokyo 1858601, Japan
Kobayashi, Keisuke
Mori, Yuki
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Hitachi Ltd, Res & Dev Grp, Higashi Koigakubo 1-280, Kokubunji, Tokyo 1858601, JapanHitachi Ltd, Res & Dev Grp, Higashi Koigakubo 1-280, Kokubunji, Tokyo 1858601, Japan
Mori, Yuki
Hisamoto, Digh
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Hitachi Ltd, Res & Dev Grp, Higashi Koigakubo 1-280, Kokubunji, Tokyo 1858601, JapanHitachi Ltd, Res & Dev Grp, Higashi Koigakubo 1-280, Kokubunji, Tokyo 1858601, Japan
Hisamoto, Digh
Shima, Akio
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Hitachi Ltd, Res & Dev Grp, Higashi Koigakubo 1-280, Kokubunji, Tokyo 1858601, JapanHitachi Ltd, Res & Dev Grp, Higashi Koigakubo 1-280, Kokubunji, Tokyo 1858601, Japan
机构:
State Univ New York Polytech Inst, Coll Nanoscale Sci & Engn, Albany, NY 12203 USAState Univ New York Polytech Inst, Coll Nanoscale Sci & Engn, Albany, NY 12203 USA
Kim, Dongyoung
Jang, Seung Yup
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State Univ New York Polytech Inst, Coll Nanoscale Sci & Engn, Albany, NY 12203 USAState Univ New York Polytech Inst, Coll Nanoscale Sci & Engn, Albany, NY 12203 USA
Jang, Seung Yup
DeBoer, Skylar
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State Univ New York Polytech Inst, Coll Nanoscale Sci & Engn, Albany, NY 12203 USAState Univ New York Polytech Inst, Coll Nanoscale Sci & Engn, Albany, NY 12203 USA
DeBoer, Skylar
Morgan, Adam J.
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State Univ New York Polytech Inst, Coll Nanoscale Sci & Engn, Albany, NY 12203 USAState Univ New York Polytech Inst, Coll Nanoscale Sci & Engn, Albany, NY 12203 USA
Morgan, Adam J.
Sung, Woongje
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State Univ New York Polytech Inst, Coll Nanoscale Sci & Engn, Albany, NY 12203 USAState Univ New York Polytech Inst, Coll Nanoscale Sci & Engn, Albany, NY 12203 USA