Design and Fabrication of SFQ chip flip -chip interconnection based on silicon bumps

被引：0
|
作者：
Li, Kun [1 ,2 ,3 ]
Xu, Gaowei [1 ,2 ,3 ]
Huang, Yang [1 ,2 ,3 ]
Zhou, Hanlin [1 ,2 ,3 ]
Zhao, Wenbo [1 ,2 ,3 ]
Xiao, Kelaiti [1 ,2 ,3 ]
Dong, Hui [1 ,2 ,3 ]
Xie, Xiaoming [1 ,2 ,3 ]
机构：
[1] Chinese Acad Sci, Shanghai Inst Microsyst & Informat Technol, Natl Key Lab Mat Integrated Circuits, Shanghai, Peoples R China
[2] CAS Ctr Excellence Superconducting Elect CENSE, Shanghai, Peoples R China
[3] Univ Chinese Acad Sci, Beijing, Peoples R China
来源：
2023 24TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT | 2023年
基金：
国家重点研发计划;
关键词：
Flip-chip; Interconnection; Superconducting integrated circuit; Silicon bump; TECHNOLOGY;
D O I：
10.1109/ICEPT59018.2023.10491983
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
In this paper. In this paper. In this paper, we developed a silicon bumping method for flip -chip interconnection of Superconducting integrated circuit is proposed. The simulation results shown that the flip -chip interconnection based on silicon bumps has excellent signal transmission performance. Through fabrication optimization, the silicon bumps were prepared by wet etching and metal deposition. Then the flip -chip interconnection of superconducting chips could be carried out to realize the superconducting multi-chip module.
引用
收藏
页数：5
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