Design and Fabrication of SFQ chip flip -chip interconnection based on silicon bumps

被引：0

作者：

Li, Kun ^{[1
,2
,3
]}

Xu, Gaowei ^{[1
,2
,3
]}

Huang, Yang ^{[1
,2
,3
]}

Zhou, Hanlin ^{[1
,2
,3
]}

Zhao, Wenbo ^{[1
,2
,3
]}

Xiao, Kelaiti ^{[1
,2
,3
]}

Dong, Hui ^{[1
,2
,3
]}

Xie, Xiaoming ^{[1
,2
,3
]}

机构：

[1] Chinese Acad Sci, Shanghai Inst Microsyst & Informat Technol, Natl Key Lab Mat Integrated Circuits, Shanghai, Peoples R China

[2] CAS Ctr Excellence Superconducting Elect CENSE, Shanghai, Peoples R China

[3] Univ Chinese Acad Sci, Beijing, Peoples R China

来源：

2023 24TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT | 2023年

基金：

国家重点研发计划;

关键词：

Flip-chip; Interconnection; Superconducting integrated circuit; Silicon bump; TECHNOLOGY;

D O I：

10.1109/ICEPT59018.2023.10491983

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

In this paper. In this paper. In this paper, we developed a silicon bumping method for flip -chip interconnection of Superconducting integrated circuit is proposed. The simulation results shown that the flip -chip interconnection based on silicon bumps has excellent signal transmission performance. Through fabrication optimization, the silicon bumps were prepared by wet etching and metal deposition. Then the flip -chip interconnection of superconducting chips could be carried out to realize the superconducting multi-chip module.

引用

页数：5

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