A Miniaturized Filtering Power Divider With High Selectivity and Wide Stopband Based on 3-D Heterogeneous Integration Technology

被引:1
|
作者
Liu, Zhi-Hao [1 ,2 ]
Zhou, Yu-Jin [3 ]
Cheng, Chong-Hu [1 ,2 ]
机构
[1] Nanjing Univ Posts & Telecommun, Coll Elect & Opt Engn, Nanjing 210046, Peoples R China
[2] Nanjing Univ Post & Telecommun, Coll Flexible Elect Future Technol, Nanjing 210046, Peoples R China
[3] Guobo Elect Co Ltd, Nanjing 210046, Peoples R China
关键词
Inductors; Equivalent circuits; Filtering; Three-dimensional displays; Bandwidth; Scattering parameters; Multichip modules; 3-D heterogeneous integration; lumped filtering power divider; miniaturization; wide stopband;
D O I
10.1109/TCSII.2024.3355036
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Based on a novel circuit of the lumped filtering power divider (FPD), a miniaturized FPD with wide stopband, high selectivity and high isolation using 3D heterogeneous integration technology is proposed. The lumped circuit can realize the filtering characteristics of transmission zeros (TZs) controllable, bandwidth controllable, and rejection controllable. 3D heterogeneous integration technology in this brief is the integration of organic substrates and integrated passive device technology by the bump flip-chip technique. In this technology, planar inductors with low Q-factor are replaced by 3D inductors with organic substrates. The measured results show the proposed FPD at the center frequency f(0) of 3.75 GHz has a 26.7% 15-dB return loss fractional bandwidth (FBW). Its 20-dB and 30-dB upper stopband can be extended to 4.19 f(0) (15.71 GHz) and 3.84 f(0) (14.39 GHz). Its 25-dB lower stopband ranges from 0 to 2.74 GHz. And the volume of the proposed FPD is 0.037 x 0.02 x 0.0045 lambda(3)(0) , where lambda(0) is the air wavelength at f(0).
引用
收藏
页码:2951 / 2955
页数:5
相关论文
共 50 条
  • [41] 3-D Compact Marchand Balun Design Based on Through-Silicon via Technology for Monolithic and 3-D Integration
    Xiong, Wei
    Dong, Gang
    Wang, Yang
    Zhu, Zhangming
    Yang, Yintang
    IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 2022, 30 (08) : 1107 - 1118
  • [42] Impact of Heterogeneous Technology Integration on the Power, Performance, and Quality of a 3D Image Sensor
    Lie, Denny
    Trivedi, Amit R.
    Mukhopadhyay, Saibal
    IEEE TRANSACTIONS ON MULTI-SCALE COMPUTING SYSTEMS, 2016, 2 (01): : 61 - 67
  • [43] Bandpass 3-D Frequency Selective Surface With High Selectivity and Wide Out -of-Band Rejection
    Xu, Jia-Wei
    Chen, Fu-Chang
    Xiang, Kai-Ran
    Wang, Yun
    2024 CROSS STRAIT RADIO SCIENCE AND WIRELESS TECHNOLOGY CONFERENCE, CSRSWTC 2024, 2024, : 524 - 525
  • [44] Fabrication of a miniaturized spectrometer based on MMIC technology to retrieve the 3-D tropospheric water vapor field
    Iturbide-Sanchez, Flavio
    Reising, Steven C.
    Jackson, Robert W.
    2006 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST, VOLS 1-5, 2006, : 2015 - +
  • [45] Compact Balanced-to-Balanced Filtering Power Divider With Wide Range and High Level of Reflectionless, Isolation, Common-Mode Rejection, and Enhanced Frequency Selectivity
    Wu, Gangxiong
    Wu, Hao
    Zhang, Wei
    Jiang, Ruirui
    Shi, Jin
    IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS, 2024,
  • [46] A Novel Flexible 3-D Heterogeneous Integration Scheme Using Electroless Plating on Chips With Advanced Technology Node
    Hu, Yu-Chen
    Lin, Chun-Pin
    Chang, Yao-Jen
    Chang, Nien-Shyang
    Sheu, Ming-Hwa
    Chen, Chi-Shi
    Chen, Kuan-Neng
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2015, 62 (12) : 4343 - 4348
  • [47] 3-D Integrated Chiplet Encapsulation (3-D ICE): High-Density Heterogeneous Integration Using SiO2-Reconstituted Tiers
    Li, Ming-Jui
    Bakir, Muhannad S.
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2021, 11 (12): : 2242 - 2245
  • [48] 3-D Heterogeneous Integration of RRAM-Based Compute-In-Memory: Impact of Integration Parameters on Inference Accuracy
    Kaul, Ankit
    Luo, Yandong
    Peng, Xiaochen
    Manley, Madison
    Luo, Yuan-Chun
    Yu, Shimeng
    Bakir, Muhannad S.
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2023, 70 (02) : 485 - 492
  • [49] An Ultra-Miniature W-Band Bandpass Filter With Ultra-Stopband Based on 3-D TSV Technology
    Sun, Chenhong
    Sun, Liguo
    Lin, Fujiang
    2023 ASIA-PACIFIC MICROWAVE CONFERENCE, APMC, 2023, : 823 - 825
  • [50] 3-D numerical model of a power station SCR system based on heterogeneous reaction kinetics
    Lei, Da
    Jin, Bao-Sheng
    Ranshao Kexue Yu Jishu/Journal of Combustion Science and Technology, 2010, 16 (03): : 236 - 240