Wafer-scale 3D Integration of 2D Materials

被引：0
|
作者：
Das, Saptarshi [1 ]
机构：
[1] Penn State Univ, University Pk, PA 16802 USA
来源：
2024 INTERNATIONAL VLSI SYMPOSIUM ON TECHNOLOGY, SYSTEMS AND APPLICATIONS, VLSI TSA | 2024年
关键词：
D O I：
10.1109/VLSITSA60681.2024.10546377
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页数：1
相关论文
共 50 条
  • [1] Wafer-scale integration of layered 2D materials by adhesive wafer bonding
    Quellmalz, Arne
    Sawallich, Simon
    Prechtl, Maximilian
    Hartwig, Oliver
    Duesberg, Georg S.
    Lemme, Max C.
    Niklaus, Frank
    Gylfason, Kristinn B.
    2D PHOTONIC MATERIALS AND DEVICES V, 2022, 12003
  • [2] Nonepitaxial Wafer-Scale Single-Crystal 2D Materials on Insulators
    Li, Junzhu
    Yuan, Yue
    Lanza, Mario
    Abate, Iwnetim
    Tian, Bo
    Zhang, Xixiang
    ADVANCED MATERIALS, 2024, 36 (11)
  • [3] Wafer-Scale 3D Integration of Silicon-on-Insulator RF Amplifiers
    Chen, C. L.
    Chen, C. K.
    Yost, D-R.
    Knecht, J. M.
    Wyatt, P. W.
    Burns, J. A.
    Warner, K.
    Gouker, P. M.
    Healey, P.
    Wheeler, B.
    Keast, C. L.
    2009 TOPICAL MEETING ON SILICON MONOLITHIC INTEGRATED CIRCUTS IN RF SYSTEMS, DIGEST OF PAPERS, 2009, : 209 - 212
  • [4] Towards wafer-scale 2D material sensors
    Steeneken, Peter G.
    Soikkeli, Miika
    Arpiainen, Sanna
    Rantala, Arto
    Jaaniso, Raivo
    Pezone, Roberto
    Vollebregt, Sten
    Lukas, Sebastian
    Kataria, Satender
    Houmes, Maurits J. A.
    alvarez-Diduk, Ruslan
    Lee, Kangho
    Suryo Wasisto, Hutomo
    Anzinger, Sebastian
    Fueldner, Marc
    Verbiest, Gerard J.
    Alijani, Farbod
    Hoon Shin, Dong
    Malic, Ermin
    van Rijn, Richard
    Nevanen, Tarja K.
    Centeno, Alba
    Zurutuza, Amaia
    van der Zant, Herre S. J.
    Merkoci, Arben
    Duesberg, Georg S.
    Lemme, Max C.
    2D MATERIALS, 2025, 12 (02):
  • [5] A wafer-scale 3-D circuit integration technology
    Burns, James A.
    Aull, Brian F.
    Chen, Chenson K.
    Chen, Chang-Lee
    Keast, Craig L.
    Knecht, Jeffrey M.
    Suntharalingam, Vyshnavi
    Warner, Keith
    Wyatt, Peter W.
    Yost, Donna-Ruth W.
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2006, 53 (10) : 2507 - 2516
  • [6] 3D Heterogeneous Integration with 2D Materials
    McClellan, Connor
    Bailey, Connor
    Datye, Isha
    Gabourie, Alexander
    Grady, Ryan
    Schauble, Kirstin
    Vaziri, Sam
    Pop, Eric
    2019 SILICON NANOELECTRONICS WORKSHOP (SNW), 2019, : 89 - 90
  • [7] Monolithic 3D integration with 2D materials
    Han, Sangmoon
    Moon, Ji-Yun
    Bae, Sang-Hoon
    NATURE ELECTRONICS, 2024, : 854 - 855
  • [8] Wafer-Scale Fabrication of 2D β-In2Se3 Photodetectors
    Claro, Marcel S.
    Grzonka, Justyna
    Nicoara, Nicoleta
    Ferreira, Paulo J.
    Sadewasser, Sascha
    ADVANCED OPTICAL MATERIALS, 2021, 9 (01)
  • [9] Wafer-Scale 3D Integration of InGaAs Image Sensors with Si Readout Circuits
    Chen, C. L.
    Yost, D-R.
    Knecht, J. M.
    Chapman, D. C.
    Oakley, D. C.
    Mahoney, L. J.
    Donnelly, J. P.
    Soares, A. M.
    Suntharalingam, V.
    Berger, R.
    Bolkhovsky, V.
    Hu, W.
    Wheeler, B. D.
    Keast, C. L.
    Shaver, D. C.
    2009 IEEE INTERNATIONAL CONFERENCE ON 3D SYSTEMS INTEGRATION, 2009, : 252 - 255
  • [10] A computational framework for guiding the MOCVD-growth of wafer-scale 2D materials
    Kasra Momeni
    Yanzhou Ji
    Nadire Nayir
    Nuruzzaman Sakib
    Haoyue Zhu
    Shiddartha Paul
    Tanushree H. Choudhury
    Sara Neshani
    Adri C. T. van Duin
    Joan M. Redwing
    Long-Qing Chen
    npj Computational Materials, 8
12345